AMD & INTEL 

Processors

Intel® Core™ M processors

Processor Number	Cache	Clock Speed	# of Cores/ # of Threads	Max TDP/ Power	Memory Types	Graphics
Intel® Core™ M-5Y31 Processor (4M Cache, up to 2.40 GHz)	4.0 MB	900 MHz	2/ 4	4.5	LPDDR3 1333/1600; DDR3L/DDR3L-RS 1600	Intel® HD Graphics 5300
Intel® Core™ M-5Y51 Processor (4M Cache, up to 2.60 GHz)	4.0 MB	1.10 GHz	2/ 4	4.5	LPDDR3 1333/1600; DDR3L/DDR3L-RS 1600	Intel® HD Graphics 5300
Intel® Core™ M-5Y71 Processor (4M Cache, up to 2.90 GHz)	4.0 MB	1.20 GHz	2/ 4	4.5	LPDDR3 1333/1600; DDR3L/DDR3L-RS 1600	Intel® HD Graphics 5300
Intel® Core™ M-5Y10c Processor (4M Cache, up to 2.00 GHz)	4.0 MB	800 MHz	2/ 4	4.5	LPDDR3 1333/1600; DDR3L/DDR3L-RS 1600	Intel® HD Graphics 5300
Intel® Core™ M-5Y10 Processor (4M Cache, up to 2.00 GHz)	4.0 MB	800 MHz	2/ 4	4.5	LPDDR3 1333/1600; DDR3L/DDR3L-RS 1600	Intel® HD Graphics 5300
Intel® Core™ M-5Y10a Processor (4M Cache, up to 2.00 GHz)	4.0 MB	800 MHz	2/ 4	4.5	LPDDR3 1333/1600; DDR3L/DDR3L-RS 1600	Intel® HD Graphics 5300
Intel® Core™ M-5Y70 Processor (4M Cache, up to 2.60 GHz)	4.0 MB	1.10 GHz	2/ 4	4.5	DDR3L 1333/1600, LPDDR3 1333/1600	Intel® HD Graphics 5300

6th Generation Intel® Core™ i7 Processor

Processor Number	Cache	Clock Speed	# of Cores/# of Threads	Max TDP/Power	Memory Types	Graphics
Intel® Core™ i7-6920HQ Processor (8M Cache, up to 3.80 GHz)	8 MB	2.9 GHz	4/8	45 W	DDR4-2133, LPDDR3-1866, DDR3L-1600	Intel® HD Graphics 530
Intel® Core™ i7-6820HQ Processor (8M Cache, up to 3.60 GHz)	8 MB	2.7 GHz	4/8	45 W	DDR4-2133, LPDDR3-1866, DDR3L-1600	Intel® HD Graphics 530
Intel® Core™ i7-6820HK Processor (8M Cache, up to 3.60 GHz)	8 MB	2.7 GHz	4/8	45 W	DDR4-2133, LPDDR3-1866, DDR3L-1600	Intel® HD Graphics 530
Intel® Core™ i7-6700HQ Processor (6M Cache, up to 3.50 GHz)	6 MB	2.6 GHz	4/8	45 W	DDR4-2133, LPDDR3-1866, DDR3L-1600	Intel® HD Graphics 530
Intel® Core™ i7-6600U Processor (4M Cache, up to 3.40 GHz)	4 MB	2.5 GHz	2/4	15 W	DDR4-2133, LPDDR3-1866, DDR3L-1600	Intel® HD Graphics 520
Intel® Core™ i7-6500U Processor (4M Cache, up to 3.10 GHz)	4 MB	2.2 GHz	2/4	15 W	DDR4-2133, LPDDR3-1866, DDR3L-1600

6th Generation Intel® Core™ i5 Processor

Processor Number	Cache	Clock Speed	# of Cores/ # of Threads	Max TDP/ Power	Memory Types	Graphics
Intel® Core™ i5-5250U Processor (3M Cache, up to 2.70 GHz)	3.0 MB	1.60 GHz	2/ 4	15	DDR3L 1333/1600, LPDDR3 1600/1866	Intel® HD Graphics 6000
Intel® Core™ i5-5257U Processor (3M Cache, up to 3.10 GHz)	3.0 MB	2.70 GHz	2/ 4	28	DDR3L 1333/1600, LPDDR3 1600/1866	Intel® Iris™ Graphics 6100
Intel® Core™ i5-5287U Processor (3M Cache, up to 3.30 GHz)	3.0 MB	2.90 GHz	2/ 4	28	DDR3L 1333/1600, LPDDR3 1600/1866	Intel® Iris™ Graphics 6100
Intel® Core™ i5-5200U Processor (3M Cache, up to 2.70 GHz)	3.0 MB	2.20 GHz	2/ 4	15	DDR3L 1333/1600, LPDDR3 1333/1600	Intel® HD Graphics 5500
Intel® Core™ i5-5300U Processor (3M Cache, up to 2.90 GHz)	3.0 MB	2.30 GHz	2/ 4	15	DDR3L 1333/1600, LPDDR3 1333/1600	Intel® HD Graphics 5500

6th Generation Intel® Core™ i3 Processor

Processor Number	Cache	Clock Speed	# of Cores/# of Threads	Max TDP/Power	Memory Types	Graphics
Intel® Core™ i3-6100H Processor (3M Cache, 2.70 GHz)	3 MB	2.7 GHz	2/4	35 W	DDR4-2133, LPDDR3-1866, DDR3L-1600	Intel® HD Graphics 530
Intel® Core™ i3-6100U Processor (3M Cache, 2.30 GHz)	3 MB	2.3 GHz	2/4	15 W	DDR4-1866/2133, LPDDR3-1600/1866	Intel® HD Graphics 520

Pentium®

Processor Number	Cache	Clock Speed	# of Cores/# of Threads	Max TDP/Power	Memory Types	Graphics
Intel® Pentium® Processor G4400T (3M Cache, 2.90 GHz)	3 MB	2.9 GHz	2/2	35 W	DDR4-1866/2133, DDR3L-1333/1600 @ 1.35V	Intel® HD Graphics 510
Intel® Pentium® Processor G4400 (3M Cache, 3.30 GHz)	3 MB	3.3 GHz	2/2	47 W	DDR4-1866/2133, DDR3L-1333/1600 @ 1.35V	Intel® HD Graphics 530
Intel® Pentium® Processor G4500 (3M Cache, 3.50 GHz)	3 MB	3.5 GHz	2/2	47 W	DDR4-1866/2133, DDR3L-1333/1600 @ 1.35V	Intel® HD Graphics 530

Celeron®

Processor Number	Cache	Clock Speed	# of Cores/ # of Threads	Max TDP/ Power	Memory Types	Graphics
Desktop
Intel® Celeron® Processor G1850 (2M Cache, 2.90 GHz)	2.0 MB	2.90 GHz	2/ 2	53	DDR3 1333	Intel® HD Graphics
Intel® Celeron® Processor G1840 (2M Cache, 2.80 GHz)	2.0 MB	2.80 GHz	2/ 2	53	DDR3 and DDR3L 1333/1600 at 1.5V	Intel® HD Graphics
Intel® Celeron® Processor G1840T (2M Cache, 2.50 GHz)	2.0 MB	2.50 GHz	2/ 2	35	DDR3 1333	Intel® HD Graphics
Intel® Celeron® Processor G1830 (2M Cache, 2.80 GHz)	2.0 MB	2.80 GHz	2/ 2	53	DDR3 1333	Intel® HD Graphics
Intel® Celeron® Processor G1820T (2M Cache, 2.40 GHz)	2.0 MB	2.40 GHz	2/ 2	35	DDR3 1333	Intel® HD Graphics
Intel® Celeron® Processor J1800 (1M Cache, up to 2.58 GHz)	1.0 MB	2.41 GHz	2/ 2	10	DDR3L 1333	Intel® HD Graphics
Intel® Celeron® Processor J1850 (2M Cache, 2.00 GHz)	2.0 MB	2.00 GHz	4/ 4	10	DDR3L 1333	Intel® HD Graphics
Intel® Celeron® Processor J1750 (1M Cache, 2.41 GHz)	1.0 MB	2.41 GHz	2/ 2	10	DDR3L 1333	Intel® HD Graphics
Intel® Celeron® Processor G1630 (2M Cache, 2.80 GHz)	2.0 MB	2.80 GHz	2/ 2	55	DDR3 1333	Intel® HD Graphics
Intel® Celeron® Processor G1620T (2M Cache, 2.40 GHz)	2.0 MB	2.40 GHz	2/ 2	35	DDR3 1333	Intel® HD Graphics
Intel® Celeron® Processor G470 (1.5M Cache, 2.00 GHz)	1.5 MB	2.00 GHz	1/ 2	35	DDR3 1066/1333	Intel® HD Graphics
Intel® Celeron® Processor G1610 (2M Cache, 2.60 GHz)	2.0 MB	2.60 GHz	2/ 2	55	DDR3 1333	Intel® HD Graphics
Intel® Celeron® Processor G1610T (2M Cache, 2.30 GHz)	2.0 MB	2.30 GHz	2/ 2	35	DDR3 1333	Intel® HD Graphics
Intel® Celeron® Processor G550T (2M Cache, 2.20 GHz)	2.0 MB	2.20 GHz	2/ 2	35	DDR3 1066	Intel® HD Graphics
Intel® Celeron® Processor G555 (2M Cache, 2.70 GHz)	2.0 MB	2.70 GHz	2/ 2	65	DDR3 1066	Intel® HD Graphics
Intel® Celeron® Processor G465 (1.5M Cache, 1.90 GHz)	1.5 MB	1.90 GHz	1/ 2	35	DDR3 1066	Intel® HD Graphics
Intel® Celeron® Processor G540T (2M Cache, 2.10 GHz)	2.0 MB	2.10 GHz	2/ 2	35	DDR3 1066	Intel® HD Graphics
Intel® Celeron® Processor G550 (2M Cache, 2.60 GHz)	2.0 MB	2.60 GHz	2/ 2	65	DDR3 1066	Intel® HD Graphics
Intel® Celeron® Processor G460 (1.5M Cache, 1.80 GHz)	1.5 MB	1.80 GHz	1/ 2	35	DDR3 1066	Intel® HD Graphics
Intel® Celeron® Processor G530 (2M Cache, 2.40 GHz)	2.0 MB	2.40 GHz	2/ 2	65	DDR3 1066	Intel® HD Graphics
Intel® Celeron® Processor G530T (2M Cache, 2.00 GHz)	2.0 MB	2.00 GHz	2/ 2	35	DDR3 1066	Intel® HD Graphics
Intel® Celeron® Processor G440 (1M Cache, 1.60 GHz)	1.0 MB	1.60 GHz	1/ 1	35	DDR3 1066	Intel® HD Graphics
Intel® Celeron® Processor E1600 (512K Cache, 2.40 GHz, 800 MHz FSB)	512 KB	2.40 GHz	2/ 2	65		No
Intel® Celeron® Processor E1400 (512K Cache, 2.00 GHz, 800 MHz FSB)	512 KB	2.00 GHz	2/ 2	65		No
Intel® Celeron® Processor E1200 (512K Cache, 1.60 GHz, 800 MHz FSB)	512 KB	1.60 GHz	2/ 2	65		No
Mobile

Intel Corporation (commonly referred to as Intel) is an American multinational technology company headquartered in Santa Clara, California. Intel is one of the world's largest and highest valued semiconductor chip makers, based on revenue.^[4] It is the inventor of the x86 series of microprocessors, the processors found in most personal computers.

Intel Corporation was founded on July 18, 1968. Intel also makes motherboard chipsets, network interface controllers andintegrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Founded by semiconductor pioneers Robert Noyce and Gordon Moore and widely associated with the executive leadership and vision of Andrew Grove, Intel combines advanced chip design capability with a leading-edge manufacturing capability. Though Intel was originally known primarily to engineers and technologists, its "Intel Inside" advertising campaign of the 1990s made it a household name, along with its Pentium processors.

Intel was an early developer of SRAM and DRAM memory chips, and this represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business. During the 1990s, Intel invested heavily in new microprocessor designs fostering the rapid growth of the computer industry. During this period Intel became the dominant supplier of microprocessors for PCs, and was known for aggressive and sometimes illegal tactics in defense of its market position, particularly againstAdvanced Micro Devices (AMD), as well as a struggle with Microsoft for control over the direction of the PC industry.^[5][6]

The 2013 rankings of the world's 100 most valuable brands published by Millward Brown Optimor showed the company's brand value at number 61.^[7]

Intel has also begun research into electrical transmission and generation.^[8][9] Intel has recently introduced a 3-D transistor that improves performance and energy efficiency.^[10] Intel has begun mass-producing this 3-D transistor, named the Tri-Gate transistor, with their 22 nm process, which is currently used in their 3rd generation core processors initially released on April 29, 2012.^[11] In 2011, SpectraWatt Inc., a solar cell spinoff of Intel, filed for bankruptcy under Chapter 11.^[12] In June 2013, Intel unveiled its fourth generation of Intel Core processors (Haswell) in an event named Computex in Taipei.^[13]

The Open Source Technology Center at Intel hosts PowerTOP and LatencyTOP, and supports other open-source projects such as Wayland, Intel Array Building Blocks, Threading Building Blocks (TBB), and Xen.^[14][15]

Intel is a portmanteau of the words integrated and electronics. The fact that "intel" is the term for intelligence information also made the name appropriate.

AMD (Advanced Micro Devices) 

AMD is the second largest maker of personal computer microprocessors after Intel. They also make flash memory, integrated circuits for networking devices, and programmable logic devices. AMD reports that it has sold over 100 million x86 (Windows-compatible) microprocessors. Its Athlon (formerly called the "K7") microprocessor, delivered in mid-1999, was the the first to support a 200 MHz bus. In March, 2000, AMD announced the first 1 gigahertz PC microprocessor in a new version of the Athlon.

Founded in 1969, AMD along with Cyrix has often offered computer manufacturers a lower-cost alternative to the microprocessors from Intel. AMD develops and manufactures its processors and other products in facilities in Sunnyvale, California, and Austin,Texas. A new fabrication facility was opened in Dresden, Germany, in 1999.

The lower cost of AMD's microprocessors was a contributor to lower PC prices in the 1998-2000 period. Reviewers generally rated the K6 and Athlon equivalent to or slightly better than comparable Pentium microprocessors from Intel. In addition to "the first mainstream 200 MHz system bus," Athlon includes a superscalarpipelining floating point unit, and a programmable L1 and L2. The Athlon uses AMD's aluminum 0.18 micron technology.

AMD FX Processors

FEATURES 

New Instruction Capabilities

• AVX - Advanced Vector Extensions increase parallelism for scientific and 3D apps using heavy floating point calculations
• FMA4 and XOP – Floating-Point Vector Multiply-Accumulate and eXtended Operations improves throughput and performance on many integer and floating point vector functions
• AES - Advanced Encryption Standard increases performance on encryption apps like TrueCrypt® and PCMark®

AMD FX Processors

We call it the new AMD FX 8-Core Processor Black Edition and it's unlocked for your overclocking pleasure.1 Experience unmatched multitasking and pure core performance with the industry's first 32nm 8-core desktop processor. Get the speed you crave with AMD Turbo CORE Technology to push your core frequencies to the limit when you need it most. Go beyond the limits of maximum speed with easy-to-use AMD OverDrive™ technology and AMD Catalyst™ Control Center™ software suites. But the best part of all? You'll get all this impressive performance at an unbelievable price. You'll be asking yourself "what competition?" in no time.

AMD FX 8-Core Processors

• The industry's first and only native 8-core desktop processor for unmatched multitasking and pure core performance with "Bulldozer" architecture.
• New 32 nanometer die shrink designed to reduce leakage for improved efficiency, increased clock rate headroom and better thermals.

AMD Turbo CORE Technology

• AMD FX Processors come equipped with AMD Turbo CORE Technology.2 AMD Turbo CORE Technology is a performance boosting technology that helps increase performance on the applications that need it the most.

AMD Balanced Smart Cache

• Shared L3 cache ( up to 8MB)
• Improved scheduling and pre-fetch capabilities
• 64-ways (16-ways/sub-cache)
• Increased data queue sizes
• Coherency for 8-cores

AMD Wide Floating Point Accelerator

• Shared FP Scheduler
• Dual 128-bit Floating point engines – capable of teaming together for 256-bit AVX instructions or operating separately with each core

HyperTransport™ Technology

• One 16-bit link at up to 5600MT/s
• Up to 8.0GB/s HyperTransport™ I/O bandwidth; Up to 16GB/s in HyperTransport Generation 3.0 mode
• Up to 37GB/s total delivered processor-to-system bandwidth (HyperTransport bus + memory bus)

Benefit: Quick access times to system I/O for better performance.

Integrated DRAM Controller with AMD Memory Optimizer Technology

• A high-bandwidth, low-latency integrated memory controller
• Supports up to DDR3-1866
• Supports new low voltage memories of 1.35V and 1.2V
• Up to 29.9GB/s memory bandwidth for DDR3
• New Pre-Fetcher improvements
• Direct communications to each core in Dual-Core module (APIC registers in each core)

Benefit: Optimized memory controller to feed more cores.

AMD Virtualization™ (AMD-V™) Technology with IOMMU

• Silicon feature-set enhancements designed to improve the performance, reliability and security of existing and future virtualization environments by allowing virtualized applications with direct and rapid access to their allocated memory.
• IOMMU is an extension to AMD64 architecture to support address translation and access protection on DMA transfers
• Security for User Level application and Virtual Machine guest operating system
• Address translation and access control
• Device isolation
• Device assignment in virtualized systems
• Security and trusted boot support
• Unified interrupt management

Benefit: Helps virtualization software to run more securely and efficiently enabling a better experience when dealing with virtual systems

AMD PowerNow!™ AMD Technology (Cool'n'Quiet™ Technology)

• Enhanced power management features which automatically and instantaneously adjusts performance states and features based on processor performance requirements
• C6 power state flushes the cache and removes voltage from individual cores to help reduce power consumption
• CC6 power state puts all cores in C6 into an even lower power state
• for quieter operation and reduced power requirements
• Separate memory controller power control
• IO-based c-state interface
• Works automatically without the need for drivers or BIOS enablement.
• Power can be switched on or off within a single clock cycle, saving energy with minimal impact to performance

Benefit: Helps users get more efficient performance by dynamically activating or turning off parts of the processor.

AMD FX PROCESSORS​
Model Number	Frequency	Total L2 Cache	L3 Cache	Packaging	Thermal Design Power	CMOS Technology
FX 9590*	4.7/5.0 GHz	8MB	8MB	socket AM3+	220W	32nm SOI
FX 9370*	4.4/4.7 GHz	8MB	8MB	socket AM3+	220W	32nm SOI
FX 8370	4.0/4.3 GHz	8MB	8MB	socket AM3+	125W	​32nm SOI
FX 8370E	​3.3/4.3 GHz	​8MB	8MB	socket AM3+	95W	32nm SOI
FX 8350	4.0/4.2 GHz	8MB	8MB	socket AM3+	125W	32nm SOI
FX 8320	3.5/4.0 GHz	8MB	8MB	socket AM3+	125W	32nm SOI
FX 8320E	3.2/4.0 GHz	8MB	8MB	socket AM3+	95W	32nm SOI
FX 6350	3.9/4.2 GHz	6MB	8MB	socket AM3+	125W	32nm SOI
FX 6300	3.5/4.1 GHz	6MB	8MB	socket AM3+	95W	32nm SOI
FX 6200	3.8/4.1 GHz	6MB	8MB	socket AM3+	125W	32nm SOI
FX 6100	3.3/3.9 GHz	6MB	8MB	socket AM3+	95W	32nm SOI
FX 4350	4.2/4.3 GHz	4MB	8MB	socket AM3+	125W	32nm SOI
FX 4300	3.8/4.0 GHz	4MB	4MB	socket AM3+	95W	32nm SOI
FX 4130	3.8/3.9 Ghz	4MB	4MB	socket AM3+	125W	32nm SOI
FX 4100	3.6/3.8 Ghz	4MB	8MB	socket AM3+	95W	32nm SOI

*Featuring a 220 Watt TDP, the AMD FX™ 9000 Series processors have special system requirements including a robust liquid cooling system. For more information, see the AMD FX™ 9000 Series system requirements page.

AMD64 Technology	Yes
Simultaneous 32- & 64-bit computing	Yes
L1 Cache (Instruction + Data) per core	128KB (64KB + 64KB)
L2 Cache (1MB per core)	8MB or 6MB or 4MB
L3 Cache	8MB (shared L3)
HyperTransport™ Technology	HyperTransport™ Technology up to 4000MT/s full duplex, or up to 16.0GB/s I/O Bandwidth
Integrated DDR3 Memory Controller	Yes
Memory Controller Width	128-bit
Type of Memory Supported	Up to DDR3 1866
Memory Bandwidth	Up to 21 GB/s dual channel memory bandwidth
Total Processor-to-system Bandwidth (HyperTransport plus memory bandwidth)	Up to 37 GB/s
Process Technology	32 nanometer, SOI (silicon-on-insulator) Technology
Packaging	AM3+
Thermal Design Power	220W, 125W, & 95W
Manufacturing Sites	GLOBALFOUNDRIES Dresden, Germany

AMD FX PROCESSORS​
Model Number	Frequency	Total L2 Cache	L3 Cache	Packaging	Thermal Design Power	CMOS Technology
FX 9590*	4.7/5.0 GHz	8MB	8MB	socket AM3+	220W	32nm SOI
FX 9370*	4.4/4.7 GHz	8MB	8MB	socket AM3+	220W	32nm SOI
FX 8370	4.0/4.3 GHz	8MB	8MB	socket AM3+	125W	​32nm SOI
FX 8370E	​3.3/4.3 GHz	​8MB	8MB	socket AM3+	95W	32nm SOI
FX 8350	4.0/4.2 GHz	8MB	8MB	socket AM3+	125W	32nm SOI
FX 8320	3.5/4.0 GHz	8MB	8MB	socket AM3+	125W	32nm SOI
FX 8320E	3.2/4.0 GHz	8MB	8MB	socket AM3+	95W	32nm SOI
FX 6350	3.9/4.2 GHz	6MB	8MB	socket AM3+	125W	32nm SOI
FX 6300	3.5/4.1 GHz	6MB	8MB	socket AM3+	95W	32nm SOI
FX 6200	3.8/4.1 GHz	6MB	8MB	socket AM3+	125W	32nm SOI
FX 6100	3.3/3.9 GHz	6MB	8MB	socket AM3+	95W	32nm SOI
FX 4350	4.2/4.3 GHz	4MB	8MB	socket AM3+	125W	32nm SOI
FX 4300	3.8/4.0 GHz	4MB	4MB	socket AM3+	95W	32nm SOI
FX 4130	3.8/3.9 Ghz	4MB	4MB	socket AM3+	125W	32nm SOI
FX 4100	3.6/3.8 Ghz	4MB	8MB	socket AM3+	95W	32nm SOI

*Featuring a 220 Watt TDP, the AMD FX™ 9000 Series processors have special system requirements including a robust liquid cooling system. For more information, see the AMD FX™ 9000 Series system requirements page.

AMD64 Technology	Yes
Simultaneous 32- & 64-bit computing	Yes
L1 Cache (Instruction + Data) per core	128KB (64KB + 64KB)
L2 Cache (1MB per core)	8MB or 6MB or 4MB
L3 Cache	8MB (shared L3)
HyperTransport™ Technology	HyperTransport™ Technology up to 4000MT/s full duplex, or up to 16.0GB/s I/O Bandwidth
Integrated DDR3 Memory Controller	Yes
Memory Controller Width	128-bit
Type of Memory Supported	Up to DDR3 1866
Memory Bandwidth	Up to 21 GB/s dual channel memory bandwidth
Total Processor-to-system Bandwidth (HyperTransport plus memory bandwidth)	Up to 37 GB/s
Process Technology	32 nanometer, SOI (silicon-on-insulator) Technology
Packaging	AM3+
Thermal Design Power	220W, 125W, & 95W
Manufacturing Sites	GLOBALFOUNDRIES Dresden, Germany

AMD A-Series APU Processors

FEATURES

Get evolved with AMD’s next-generation APU

Introducing AMD’s most advanced APU technology. The AMD A10-7870K challenges the very definition of a processor with 12 Compute Cores (4 CPU + 8 GPU)* and innovative Graphics Core Next (GCN) architecture.1

*Visit amd.com/ComputeCores to learn more about compute cores ​

Features

Tuned for Modern Workloads

AMD A-Series APUs utilize the latest AMD Turbo Core technologies to maximum CPU and GPU performance in your latest applications, enabling up to 4.1GHz of CPU performance to deliver an amazing experience

Get fantastic performance with GCN architecture

Immerse yourself in leading-edge graphics technology with Graphics Core Next (GCN) architecture from AMD. This third-generation technology unlocks advanced features and the stunning performance of AMD Radeon™ graphics.1

Raise your game with DirectX™ 12, Vulkan™, & Mantle

The new AMD A-Series APUs support the latest graphics APIs to bring next generation games to life. With support for these latest technologies in the latest AMD APUs, you can game at unprecedented levels of performance, with impressive effects and details.2

Experience breathtaking immersive audio

AMD TrueAudio technology provides 32-channel surround audio to make games sound better and deliver more accurate voice recognition. Experience a whole new level of immersion.3

Unlock your system’s full compute potential with HSA

Revolutionary Heterogeneous System Architecture (HSA) is a new standard in processor design where the CPU and GPU work together in harmony. With HSA, the full potential of AMD hardware enables more efficient performance, so applications are fast and responsive.

SPECS

AMD A-SERIES ACCELERATED PROCESSOR MODEL NUMBER AND FEATURE COMPARISONS ​
Model	Radeon™ Brand	Compute Cores*	CPU Clock Speed	GPU Clock Speed	TDP	Total L2 Cache	DDR3 Speed	Display Capabilities​
​A10-7870K*	​Radeon™ R7	​12 (4 CPU + 8GPU)	4.1 GHz/ 3.9 GHz	866 MHz	95W	4 MB	​2133	​HDMI 1.4a, Display Port 1.2, DVI, AMD Freesync™ technology
A10-7850K4	Radeon™ R7 graphics	12 (4 CPU + 8GPU)	4.0 GHz/ 3.7 GHz	720 MHz	95 W	4 MB	2133	​HDMI 1.4a, Display Port 1.2, DVI, AMD Freesync™ technology
A10-7800	Radeon™ R7 graphics	12 (4 CPU +  8 GPU)	3.9 GHz/ 3.5 GHz	720 MHz	65 W/ 45 W	4 MB	2133	​HDMI 1.4a, Display Port 1.2, DVI, AMD Freesync™ technology
A10-7700K4	Radeon™ R7 graphics	10 (4 CPU + 6GPU)	3.8 GHz/ 3.4 GHz	720 MHz	95 W	4 MB	2133	​HDMI 1.4a, Display Port 1.2, DVI, AMD Freesync™ technology
​A8-7670K	​Radeon™ R7 graphics	​10 (4 CPU + 6 GPU)³	​3.9 GHz/3.6 GHz	​757 MHz	​95 W	​4 MB	​2133	​HDMI 1.4a, Display Port 1.2, DVI, AMD Freesync™ technology
A8-7650K	​Radeon™ R7 graphics	​10 (4 CPU + 6 GPU)³	​3.8 GHz/3.3 GHz	​720 MHz	​95 W	​4 MB	​2133	​HDMI 1.4a, Display Port 1.2, DVI, AMD Freesync™ technology
A8-7600	Radeon™ R7 graphics	10 (4 CPU +  6 GPU)	3.8 GHz/ 3.1 GHz	720 MHz	65 W/ 45 W	4 MB	2133	​HDMI 1.4a, Display Port 1.2, DVI, AMD Freesync™ technology
A6-7400K4	Radeon™ R5 graphics	6 (2 CPU +  4 GPU)	3.9 GHz/ 3.5 GHz	756 MHz	65 W/ 45 W	1 MB	1866	​HDMI 1.4a, Display Port 1.2, DVI, AMD Freesync™ technology

AMD PRO A-SERIES ACCELERATED PROCESSORS ​
Model	Radeon™ Brand	Compute Cores*	CPU Clock Speed	GPU Clock Speed	TDP	Total L2 Cache	DDR3 Speed	​Display Capabilities
A10 PRO-7850B	Radeon™ R7 graphics	12 (4 CPU + 8GPU)	4.0 GHz/ 3.7 GHz	720 MHz	95 W	4 MB	2133	​HDMI 1.4a, Display Port 1.2, DVI
A10 PRO-7800B	Radeon™ R7 graphics	12 (4 CPU + 8GPU)	3.9 GHz/ 3.5 GHz	720 MHz	65 W/ 35 W	4 MB	2133	​HDMI 1.4a, Display Port 1.2, DVI
A8 PRO-7600B	Radeon™ R7 graphics	10 (4 CPU + 6GPU)	3.8 GHz/ 3.1 GHz	720 MHz	65 W/ 35 W	4 MB	2133	​HDMI 1.4a, Display Port 1.2, DVI
A6 PRO-7400B	Radeon™ R5 graphics	6 (2 CPU + 4GPU)	3.9 GHz/ 3.5 GHz	756 MHz	65 W/ 35 W	1 MB	1866	​HDMI 1.4a, Display Port 1.2, DVI
​A4 PRO-7350B	​Radeon™ R5 graphics	​5 (2 CPU + 3GPU)	​3.8 GHz/ 3.4 GHz	​514 MHz	​65 W/ 35 W	​1 MB	​1866	​HDMI 1.4a, Display Port 1.2, DVI
​A4 PRO-7300B	​Radeon™ HD8470D graphics	​N/A	​4.0 GHz/ 3.8 GHz	​800 MHz	​65 W	​1 MB	​1600	​HDMI 1.4a, Display Port 1.2, DVI

AMD A-SERIES ACCELERATED PROCESSOR MODEL NUMBER AND FEATURE COMPARISONS             ​
Model	Radeon™ Brand	CPU Clock Speed	CPU Cores  on Die	TDP	Total L2 Cache	Radeon™ Cores on Die*	GPU Clock Speed	DDR3 Speed	Display Capabilities​
A10-6800K4	HD 8670D	4.4 GHz/ 4.1 GHz	4 cores	100 W	4 MB	384	844 MHz	2133	​HDMI 1.4a, Display Port 1.2, DVI
A10-6790K4	HD 8670D	4.3 GHz/ 4.0 GHz	4 cores	100 W	4 MB	384	844 MHz	1866	​HDMI 1.4a, Display Port 1.2, DVI
A10-6700	HD 8670D	4.3 GHz/ 3.7 GHz	4 cores	65 W	4 MB	384	844 MHz	1866	​HDMI 1.4a, Display Port 1.2, DVI
A10-6700T	HD 8670D	3.5 GHz/ 2.5 GHz	4 cores	45 W	4 MB	384	720 MHz	1866	​HDMI 1.4a, Display Port 1.2, DVI
A10-5800K4	HD 7660D	4.2 GHz/ 3.8 GHz	4 cores	100 W	4 MB	384	800 MHz	1866	​HDMI 1.4a, Display Port 1.2, DVI
A10-5700	HD 7660D	4.0 GHz/ 3.4 GHz	4 cores	65 W	4 MB	384	760 MHz	1866	​HDMI 1.4a, Display Port 1.2, DVI
A8-6600K4	HD 8570D	4.2 GHz/ 3.9 GHz	4 cores	100 W	4 MB	256	844 MHz	1866	​HDMI 1.4a, Display Port 1.2, DVI
A8-6500	HD 8570D	4.1 GHz/ 3.5 GHz	4 cores	65 W	4 MB	256	800 MHz	1866	​HDMI 1.4a, Display Port 1.2, DVI
A8-6500T	HD 8570D	3.1 GHz/ 2.1GHz	4 cores	45 W	4 MB	256	720 MHz	1600	​HDMI 1.4a, Display Port 1.2, DVI
A8-5600K4	HD 7560D	3.9 GHz/ 3.6 GHz	4 cores	100 W	4 MB	256	760 MHz	1866	​HDMI 1.4a, Display Port 1.2, DVI
A8-5500	HD 7560D	3.7 GHz/ 3.2 GHz	4 cores	65W	4 MB	256	760 MHz	1866	​HDMI 1.4a, Display Port 1.2, DVI
A8-3850	HD 6550D	2.9 GHz	4 cores	100W	4 MB	400	600 MHz	1866	​HDMI 1.1a, Display Port 1.2, DVI
A8-3820	HD 6550D	2.8 GHz/ 2.5 GHz	4 cores	65 W	4 MB	400	600 MHz	1866	​HDMI 1.1a, Display Port 1.2, DVI
A8-3800	HD 6550D	2.7 GHz/ 2.4 GHz	4 cores	65 W	4 MB	400	600 MHz	1866	​HDMI 1.1a, Display Port 1.2, DVI
A6-6400K	HD 8470D	4.1 GHz/ 3.9 GHz	2 cores	65 W	1 MB	192	800 MHz	1866	​HDMI 1.4a, Display Port 1.2, DVI
A6-5400K	HD 7540D	3.8 Ghz/ 3.6 GHz	2 cores	65 W	1 MB	192	760 MHz	1866	​HDMI 1.4a, Display Port 1.2, DVI
A6-5200	HD 8400	2.0 Ghz	4 cores	25 W	2 MB	128	600 MHz	1600	​HDMI 1.4a, Display Port 1.2, DVI
A6-3670K4	HD 6530D	2.7 GHz	4 cores	100 W	4 MB	320	444 MHz	1866	​HDMI 1.1a, Display Port 1.2, DVI
A6-3650	HD 6530D	2.6 GHz	4 cores	100 W	4 MB	320	443 MHz	1866	​HDMI 1.1a, Display Port 1.2, DVI
A6-3620	HD 6530D	2.5 GHz/ 2.2 GHz	4 cores	65 W	4 MB	320	444 MHz	1866	​HDMI 1.1a, Display Port 1.2, DVI
A6-3600	HD 6530D	2.4 GHz/ 2.1 GHz	4 cores	65 W	4 MB	320	443 MHz	1866	​HDMI 1.1a, Display Port 1.2, DVI
A6-3500	HD 6530D	2.4 GHz/ 2.1 GHz	3 cores	65 W	3 MB	320	443 MHz	1866	​HDMI 1.1a, Display Port 1.2, DVI
A4-7300	HD 8470D	4.0GHz/ 3.8GHz	2 cores	65W/45W	1 MB	192	800 MHz	1600	​HDMI 1.4a, Display Port 1.2, DVI
A4-6320	HD 8370D	4.0GHz/ 3.9GHz	2 cores	65 W	1 MB	128	760 MHz	1600	​HDMI 1.4a, Display Port 1.2, DVI
A4-6300	HD 8370D	3.9GHz/ 3.7GHz	2 cores	65 W	1 MB	128	760 MHz	1600	​HDMI 1.4a, Display Port 1.2, DVI
A4-5300	HD 7480D	3.6 Ghz/ 3.4 GHz	2 cores	65 W	1 MB	128	723 MHz	1600	​HDMI 1.4a, Display Port 1.2, DVI
A4-5000	HD 8330	1.50 Ghz	4 cores	15 W	2 MB	128	500 MHz	1600	​HDMI 1.4a, Display Port 1.2, DVI
A4-4020	HD 7480D	3.2 Ghz/ 3.4 Ghz	2 cores	65 W	1 MB	128	760 MHz	1333	​HDMI 1.4a, Display Port 1.2, DVI
A4-4000	HD 7480D	3.2G hz/ 3.0G Hz	2 cores	65 W	1 MB	160	720 MHz	1333	​HDMI 1.4a, Display Port 1.2, DVI
A4-3400	HD 6410D	2.7 GHz	2 cores	65 W	1 MB	160	600 MHz	1600	​HDMI 1.1a, Display Port 1.2, DVI
A4-3300	HD 6410D	2.5 GHz	2 cores	65 W	1 MB	160	443 MHz	1600	​HDMI 1.1a, Display Port 1.2, DVI

AMD Athlon™ APUs

FEATURES

Upgradable platform

Designed to grow as your needs do.

• Utilize the flexible AM1 platform and select the AMD Athlon™ or AMD Sempron™ APU that’s right for you
• Pack more performance into your rig as the AM1 platform updates and improves

Incredible value

Take advantage with affordable, multitasking performance and sharp, vivid HD graphics

• AMD Radeon™ R3 graphics help exceed expectations for accelerated HD playback and everyday performance
• Socketed AM1 motherboards can enable small, sleek form factors with extraordinary value

Latest technology and features

Enjoy dynamic interactivity and exceptional features, including:

• Microsoft® DirectX® 11.2 and support for Windows 8.1 for an immersive experience on the most advanced OS
• Video Codec Engine (VCE) enables fast encoding across multiple devices so you can enjoy media almost anywhere
• Support for lightning-fast USB 3.0 and SATA 6GBps connectivity so you can access the content you want, whenever you need it

SPECS

AMD ATHLON™ APU PROCESSORS ​ ​
Model Number	5350	5150
AMD Radeon™ Brand	Radeon™ R3 Graphics	Radeon™ R3 Graphics
CPU Cores	4	4
CPU Clock Speed	2.05 GHz	1.6 GHz
TDP	25W	25W
Total Dedicated L2 Cache	2MB	2MB
Radeon™ Cores	128	128
GPU Clock Speed	600 MHz	600 MHz
GCN Technology	Yes	Yes
Platform	AM1	AM1
DDR3 Speed	1600	1600

OTHER AMD ATHLON PROCESSORS

Affordable performance for everyday computing

Get to fun, faster, with a system that boots and loads applications quickly and easily. Enjoy reliable, responsive performance on thousands of software applications—including those that let you communicate with family and friends.

Features & Benefits

• Affordable - performance
• Full-featured to improve your computing experience
• AMD64 technology
• HyperTransport™ technology
• Enjoy full compatibility with the tools you use daily
• Get more value from your PC
• Reliability from an industry leader  

More information:

• AMD Athlon™ CPU
• AMD Athlon™ II CPU

AMD Sempron™ APUs

FEATURES

Upgradable platform

Designed to grow as your needs do.

• Utilize the flexible AM1 platform and select the AMD Athlon™ or AMD Sempron™ APU that’s right for you
• Pack more performance into your rig as the AM1 platform updates and improves

Incredible value

Take advantage with affordable, multitasking performance and sharp, vivid HD graphics

• AMD Radeon™ R3 graphics help exceed expectations for accelerated HD playback and everyday performance
• Socketed AM1 motherboards can enable small, sleek form factors with extraordinary value

Latest technology and features

Enjoy dynamic interactivity and exceptional features, including:

• Microsoft® DirectX® 11.2 and support for Windows 8.1 for an immersive experience on the most advanced OS
• Video Codec Engine (VCE) enables fast encoding across multiple devices so you can enjoy media almost anywhere
• Support for lightning-fast USB 3.0 and SATA 6GBps connectivity so you can access the content you want, whenever you need it

SPECS

AMD SEMPRON™ APU PROCESSORS ​ ​
Model Number	3850	2650
AMD Radeon™ Brand	Radeon™ R3 Graphics	Radeon™ R3 Graphics
CPU Cores	4	2
CPU Clock Speed	1.3 GHz	1.45 GHz
TDP	25W	25W
Total Dedicated L2 Cache	2MB	1MB
Radeon™ Cores	128	128
GPU Clock Speed	450 MHz	400 MHz
GCN Technology	Yes	Yes
Platform	AM1	AM1
DDR3 Speed	1600	1333

OTHER AMD SEMPRON PROCESSORS

Affordable performance for everyday computing

Get to fun, faster, with a system that boots and loads applications quickly and easily. Enjoy reliable, responsive performance on thousands of software applications—including those that let you communicate with family and friends.

Features & Benefits

• Affordable - performance
• Full-featured to improve your computing experience
• AMD64 technology
• HyperTransport™ technology
• Enjoy full compatibility with the tools you use daily
• Get more value from your PC
• Reliability from an industry leader

More information:

• AMD Sempro​n™ CPU

AMD Phenom™ II Processors

FEATURES

AMD Phenom™ II X6 Six-Core Processors

The backbone of the VISION Black technology platform, the new AMD Phenom™ II X6 six-core processors are the fastest CPUs AMD has ever created. The AMD Phenom™ II X6 six-core processors are also the world's only six-core processors for under $200*. At the heart of a VISION Black Technology platform, the AMD Phenom II X6 processor is the most advanced AMD desktop processor and features innovative AMD Turbo CORE technology to adjust to the dynamic needs of performance users.

New AMD Turbo CORE Technology

Both the AMD Phenom™ II X6 1055T and 1090T come equipped with AMD's new Turbo CORE technology. AMD Turbo CORE technology is a performance boosting technology that automatically switches from six cores to three turbocharged core for applications that just need raw speed over multiple cores. While in Turbo CORE mode, the AMD Phenom™ II X6 1090T shifts frequency speed from 3.2GHz on six cores, to 3.6GHz on three cores, making it the fastest processor AMD has ever created.

AMD Phenom™ II Triple and Quad-Core Processors

• True quad-core and triple-core designed from the ground up for better communication between cores.
  • Benefit: Cores can communicate on die rather than on package for better performance

AMD64 with Direct Connect Architecture

• Helps improve system performance and efficiency by directly connecting the processors, the memory controller, and the I/O to the CPU.
• Designed to enable simultaneous 32- and 64-bit computing
• Integrated Memory Controller
  • Benefits: Increases application performance by dramatically reducing memory latency
  • Scales memory bandwidth and performance to match compute needs
  • HyperTransport™ Technology provides up to 16.0GB/s peak bandwidth per processor—reducing I/O bottlenecks
  • Up to 37GB/s total delivered processor-to-system bandwidth (HyperTransport bus + memory bus)

AMD Balanced Smart Cache

• Shared L3 cache (either 6MB or 4MB)
• 512K L2 cache per core
  • Benefit: Shortened access times to the highly accessed data for better performance.

AMD Wide Floating Point Accelerator

• 128-bit floating point unit (FPU)
• High performance (128bit internal data path) floating point unit per core.
  • Benefit: Larger data paths and quicker floating point calculations for better performance.

HyperTransport™ Technology

• One 16-bit link at up to 4000MT/s
• Up to 8.0GB/s HyperTransport™ I/O bandwidth; Up to 16GB/s in HyperTransport Generation 3.0 mode
• Up to 37GB/s total delivered processor-to-system bandwidth (HyperTransport bus + memory bus)
  • Benefit: Quick access times to system I/O for better performance.

Integrated DRAM Controller with AMD Memory Optimizer Technology

• A high-bandwidth, low-latency integrated memory controller
• Supports PC2-8500 (DDR2-1066); PC2-6400 (DDR2-800), PC2-5300 (DDR2-667), PC2-4200 (DDR2-533) or PC2-3200 (DDR2-400) SDRAM unbuffered DIMMs – AM2+
• Support for unregistered DIMMs up to PC2 8500(DDR2-1066MHz) and PC3 10600 (DDR3-1333MHz) – AM3
• Up to 17.1GB/s memory bandwidth for DDR2 and up to 21GB/s memory bandwidth for DDR3
  • Benefit: Quick access to system memory for better performance.

AMD Virtualization™ (AMD-V™) Technology With Rapid Virtualization Indexing

• Silicon feature-set enhancements designed to improve the performance, reliability, and security of existing and future virtualization environments by allowing virtualized applications with direct and rapid access to their allocated memory.
  • Benefit: Helps virtualization software to run more securely and efficiently enabling a better experience when dealing with virtual systems

AMD PowerNow!™ Technology (Cool’n’Quiet™ Technology)

• Enhanced power management features which automatically and instantaneously adjusts performance states and features based on processor performance requirements
• For quieter operation and reduced power requirements
  • Benefit: Enables cooler and quieter platform designs by providing extremely efficient performance and energy usage.

AMD CoolCore™ Technology

• Reduces processor energy consumption by turning off unused parts of the processor. For example, the memory controller can turn off the write logic when reading from memory, helping reduce system power.
• Works automatically without the need for drivers or BIOS enablement.
• Power can be switched on or off within a single clock cycle, saving energy with no impact to performance.
  • Benefit: Helps users get more efficient performance by dynamically activating or turning off parts of the processor.

Dual Dynamic Power Management™

• Enables more granular power management capabilities to reduce processor energy consumption.
• Separate power planes for cores and memory controller, for optimum power consumption and performance, creating more opportunities for power savings within the cores and memory controller.
  • Benefit: Helps improve platform efficiency by providing on demand memory performance while still allowing for decreased system power consumption

*As of 4/27 AMD offers a six core consumer CPU at a lower price than competing four core consumer CPUs from Intel.  Intel Core i5 750 priced at $199 USD as advertised on www.newegg.com on 4/15. AMD's SEP for the AMD Phenom II X6 1055T processor is $199.

MODEL NUMBER COMPARISON

AMD PHENOM™ II X6 PROCESSOR
Model Number	Frequency	Total L2 Cache	L3 Cache	Packaging	Thermal Design Power	CMOS Technology
1100T*	3.3 GHz	3MB	6MB	socket AM3	125W	45nm SOI
1090T*	3.2 GHz	3MB	6MB	socket AM3	125W	45nm SOI
1075T	3.0 GHz	3MB	6MB	socket AM3	125W	45nm SOI
1065T	2.9 GHz	3MB	6MB	socket AM3	95W	45nm SOI
1055T	2.8 GHz	3MB	6MB	socket AM3	125W	45nm SOI
1045T	2.7 GHz	3MB	6MB	socket AM3	95W	45nm SOI

AMD PHENOM™ II X4 PROCESSOR
Model Number	Frequency	Total L2 Cache	L3 Cache	Packaging	Thermal Design Power	CMOS Technology
980*	3.7 GHz	2MB	6MB	socket AM3	125W	45nm SOI
975*	3.6 GHz	2MB	6MB	socket AM3	125W	45nm SOI
970*	3.5 GHz	2MB	6MB	socket AM3	125W	45nm SOI
965*	3.4 GHz	2MB	6MB	socket AM3	125W	45nm SOI
955*	3.2 GHz	2MB	6MB	socket AM3	125W	45nm SOI
850	3.3 GHz	2MB	​	socket AM3	95W	45nm SOI

ENERGY EFFICIENT AMD PHENOM™ II X4 PROCESSOR PRODUCT MODEL COMPARISONS
Model Number	Frequency	Total L2 Cache	L3 Cache	Packaging	Thermal Design power	CMOS Technology
910e	2.6GHz	2MB	6MB	socket AM3	65W	45nm SOI

AMD PHENOM™ II X2 PROCESSOR
Model Number	Frequency	Total L2 Cache	Packaging	Thermal Design power	CMOS Technology
565*	3.4GHz	1MB	socket AM3	80W	45nm SOI
560*	3.3GHz	1MB	socket AM3	80W	45nm SOI

AMD PHENOM II X4 B SERIES PROCESSOR
Model Number	Cores	Clock Frequency	I/O Bus Speed1	Package Profile	Memory Speed	Voltage	Max Temp	TDP	Dedicated L2 Cache	L3 Cache	Process Technology
B97	4	3.2GHz	4.0GT/s	Socket AM3	DDR3-1333	0.80-1.425V	71'C	95W	2	6	45nm SOI
B95	4	3.0GHz	4.0GT/s	Socket AM3	DDR3-1333	0.80 -1.425V	71'C	95W	2	6	45nm SOI
B93	4	2.8GHz	4.0GT/s	Socket AM3	DDR3-1333	0.80 -1.425V	71'C	95W	2	6	45nm SOI

*Available as Black Edition PIB ​
AMD64 Technology	Yes
Simultaneous 32- & 64-bit computing	Yes
L1 Cache (Instruction + Data) per core	128KB (64KB + 64KB)
L2 Cache (512KB per core)	2MB or 1.5MB or 1MB
L3 Cache	6MB (shared L3)
HyperTransport™ Technology	HyperTransport™ Technology up to 4000MT/s full duplex, or up to 16.0GB/s I/O Bandwidth
Integrated DDR2 Memory Controller	Yes
Memory Controller Width	128-bit
Type of Memory Supported	Support for unregistered DIMMs up to PC2 8500(DDR2-1066MHz) and PC3 10600 (DDR3-1333MHz)
Memory Bandwidth	up to 21 GB/s dual channel memory bandwidth
Total Processor-to-system Bandwidth (HyperTransport plus memory bandwidth)	up to 37 GB/s
Process Technology	45 nanometer, SOI (silicon-on-insulator) Technology
Packaging	AM3(938-pin) organic micro PGA
Thermal Design Power	140W, 125W, 95W, 80W or 65W
Manufacturing Sites	GLOBALFOUNDRIES Dresden, Germany

AMD Athlon™ II Processors

FEATURES

Performance Enhancements

AMD Direct Connect Architecture

An award-winning technology designed to reduce bottlenecks that can exist when multiple components compete for access to the processor bus. Competing x86 systems use a single front-side bus (FSB) which must carry memory access, graphics, and I/O traffic. Eliminate the FSB, and you can reduce delays that competing access requests can cause.

AMD Wide Floating Point Accelerator

Doubles processor bandwidth from 64- to a full 128-Bit Floating-Point math processing pipeline that can double many of the bandwidth paths that help keep it full.

AMD Digital Media XPress™ 2.0 Technology

Provides support for SSE, SSE2, SSE3, SSE4a, and MMX instructions for digital media applications and security.

CPU Architectural Features

True Multi-Core Processing

The extensive AMD64 architectural optimizations and features enable thorough integration of multiple cores within the same processor, with each core having its own L1 and L2 caches.

AMD Dedicated Multi-Cache

Each core has its own dedicated L2 cache, which enables simultaneous independent core access to L2 cache, eliminating the need for cores to arbitrate for cache access. This helps reduce latency on L2 cache accesses.

AMD Virtualization™ (AMD-V™) Technology

Silicon feature-set enhancements designed to improve the performance, reliability, and security of both existing and future virtualization environments.

AMD PowerNow! 3.0 Technology

The latest power management technologies that deliver performance on demand when you need it, and power savings when you don't.

Simultaneous 32-bit and 64-bit Computing

AMD64 technology enables a breakthrough approach to 64-bit computing that doubles the number of registers in the processor and allows PC users to use today’s 32-bit software applications while enabling them to also use the next generation of 64-bit applications.

CPU Power Management Technologies Featured In AMD PowerNow!™ 3.0 Technology

Cool’n’Quiet™ 3.0 Technology

Up to eight different performance states help enhance power efficiency. Simplified performance state transitions can reduce latency and the software overhead of performance state changes.

AMD Dynamic Power Management

Each processor core, and the integrated memory controller and HyperTransport™ controller, is powered by dedicated voltage planes.

Integrated Dual-Channel Memory Controller

Directly connects the processor to memory for optimum performance, low latency, and high throughput.

Multi-Point Thermal Control

The next-generation design features multiple on-die thermal sensors with digital interface. Automatic reduction of p-state when temperature exceeds pre-defined limit. Additional memory thermal management interface.

AMD CoolCore™ Technology

Coarse and fine transistor control that can automatically reduce processor energy consumption by turning off unused parts of the processor.

MODEL NUMBER COMPARISON

AMD ATHLON™ II X4 QUAD-CORE PROCESSOR ​ ​ ​ ​ ​
Model Number	Frequency	CMOS Technology	Total Dedicated L2 Cache	Packaging	Thermal Design Power
651	3.0 GHz	32nm SOI	4MB	socket FM1	100W
645	3.1 GHz	45nm SOI	2MB	socket AM3	95W
641	2.8 GHz	32nm SOI	4MB	socket FM1	100W
640	3.0 GHz	45nm SOI	2MB	socket AM3	95W
638	2.7 GHz	32nm SOI	4MB	socket FM1	65W
631	2.6 GHz	32nm SOI	4MB	socket FM1	100W

ENERGY EFFICIENT AMD ATHLON™ II X4 QUAD-CORE PROCESSOR ​ ​ ​ ​ ​
Model Number	Frequency	CMOS Technology	Total Dedicated L2 Cache	Packaging	Thermal Design Power
620e	2.6 GHz	45nm SOI	2MB	socket AM3	45W
615e	2.5 GHz	45nm SOI	2MB	socket AM3	45W

ENERGY EFFICIENT AMD ATHLON™ II X3 TRIPLE-CORE PROCESSOR ​ ​ ​ ​ ​
Model Number	Frequency	CMOS Technology	Total Dedicated L2 Cache	Packaging	Thermal Design Power
425e	2.7 GHz	45nm SOI	1.5MB	socket AM3	45W
420e	2.6 GHz	45nm SOI	1.5MB	socket AM3	45W

AMD ATHLON™ II X2 DUAL-CORE PROCESSOR ​ ​ ​ ​ ​
Model Number	Frequency	CMOS Technology	Total Dedicated L2 Cache	Packaging	Thermal Design Power
270	3.4 GHz	45nm SOI	2MB	socket AM3	65W
265	3.3 GHz	45nm SOI	2MB	socket AM3	65W
260	3.2 GHz	45nm SOI	2MB	socket AM3	65W
255	3.1 GHz	45nm SOI	2MB	socket AM3	65W
250	3.0 GHz	45nm SOI	2MB	socket AM3	65W
240	2.8 GHz	45nm SOI	2MB	socket AM3	65W

ENERGY EFFICIENT AMD ATHLON™ II X2 DUAL-CORE PROCESSOR ​ ​ ​ ​ ​
Model Number	Frequency	CMOS Technology	Total Dedicated L2 Cache	Packaging	Thermal Design Power
250e	3.0GHz	45nm SOI	2MB	socket AM3	45W
245e	2.9GHz	45nm SOI	2MB	socket AM3	45W

AMD64 Technology	Yes
Simultaneous 32- & 64-bit computing	Yes
L1 Cache (Instruction + Data)	64K of L1 instruction and 64K of L1 data cache per core X2 - 256KB total L1 per processor X3 – 384KB total L1 per processor X4 - 512KB total L1 per processor
L2 Cache (total dedicated)	X2 - 2MB X3 – 1.5MB  X4 - 2MB
Integrated DDR Memory Controller	Yes
Memory Controller Width	128-bit
Type of Memory Supported	X2 - Support for unregistered DIMMs up to PC2-8500 (DDR2-1066MHz) -AND- PC3-8500 (DDR3-1066MHz) X3 and X4 - Support for unregistered DIMMs up to PC2-8500 (DDR2-1066MHz) -AND- PC3 10600 (DDR3-1333MHz)
Total Processor-to-System Bandwidth	X2 – Up to 33.1GB/s bandwidth [Up to 17.1 GB/s total bandwidth (DDR3-1066) + 16.0GB/s (HT3)] Up to 28.8GB/s bandwidth  [Up to 12.8 GB/s total bandwidth (DDR2-1066) + 16.0GB/s (HT3)] X3 and X4 – Up to 37.3GB/s total bandwidth [Up to 21.3 GB/s memory bandwidth (DDR3-1333) + 16.0GB/s (HT3)] Up to 28.8GB/s bandwidth [Up to 12.8 GB/s total bandwidth (DDR2-1066) + 16.0GB/s (HT3)]
Thermal Design Power	45W, 65W and 95W
Manufacturing Sites	GLOBALFOUNDRIES Fab 1 Module 1.

Comparison

• Competitive Comparison

AMD Athlon™ Processors

AMD Athlon™ X4 Quad-Core Processors

MODEL NUMBER	FREQUENCY	CMOS TECHNOLOGY	TOTAL DEDICATED L2 CACHE	SOCKET	THERMAL DESIGN POWER
860K	4.0GHz/3.7GHz	28nm	4MB	FM2+	95W
840	3.8GHz/3.1GHz	28nm	4MB	FM2+	65W
760K	4.1GHz/3.8GHz	32nm	4MB	FM2/FM2+	100W
750	3.9GHz/3.4GHz	32nm	4MB	FM2/FM2+	65W
750K	4.0GHz/3.4GHz	32nm	4MB	FM2/FM2+	100W
740	3.7GHz/3.2GHz	32nm	4MB	FM2/FM2+	65W

AMD Athlon™ X2 Dual-Core Processors

MODEL NUMBER	FREQUENCY	CMOS TECHNOLOGY	TOTAL DEDICATED L2 CACHE	SOCKET	THERMAL DESIGN POWER
450	3.9GHz/3.5GHz	28nm	1MB	FM2+	65W
370K	4.2GHz/4.0GHz	32nm	1MB	FM2/FM2+	65W
350	3.9GHz/3.5GHz	32nm	1MB	FM2/FM2+	65W
340	3.6GHz/3.2GHz	32nm	1MB	FM2/FM2+	65W

A small number of AMD Athlon X4 860K processor-in-a-box (PIB) products were shipped between July and October 2014 with an incorrect definition label affixed to the product packaging. This label incorrectly stated the CPU base and boost frequencies as 3.4GHz / 3.9GHz instead of 3.7GHz/4.0GHz. AMD’s warranty for end consumers is not affected.

AMD Sempron™ CPU

FEATURES

---

Get affordable performance that redefines everyday computing

• Get to fun, fast, with a system that boots and loads applications quickly and easily
• Enjoy reliable, responsive performance on thousands of software applications—including those that let you communicate with family and friends

The AMD64 core provides leading-edge performance for both 32-bit and 64-bit applications

• AMD64 technology provides full-speed support for x86 code base without compromising performance
• 40-bit physical addresses, 48-bit virtual addresses
• Sixteen 64-bit integer registers
• Sixteen 128-bit SSE/SSE2/SSE3 registers
• AMD Digital Media XPress™ provides support for SSE, SSE2, SSE3 and MMX instructions

A high-bandwidth, low-latency integrated DDR memory controller

• Supports PC2-5300 (DDR2-667), PC2-4200 (DDR2-533) or PC2-3200 (DDR2-400) SDRAM unbuffered DIMMs
• Support for 64-bit DDR2 SDRAM memory
• Up to 10.6GB/s memory bandwidth

HyperTransport™ Technology for high speed I/O communication

• One 16-bit link up to 2000MHz bidirectional
• Up to 6.4GB/s HyperTransport™ I/O bandwidth
• Up to 17.0GB/s total delivered processor-to-system bandwidth (HyperTransport bus + memory bus)

Large high performance on-chip cache

FM2/FM2+ MODEL NUMBER COMPARISON

SOCKET	MODEL NUMBER	FREQUENCY	L2 CACHE	THERMAL DESIGN POWER
FM2/FM2+	250	3.6GHz/3.2GHz	1MB	65W
FM2/FM2+	240	3.3GHz/2.9GHz	1MB	65W

AM3 COMPARISON

AMD SEMPRON™ CPU
Socket/Technology	Model Number	Frequency	L2 Cache	Thermal Design Power
Socket AM3	150	2.9GHz	1MB	45W
Socket AM3	145	2.8GHz	1MB	45W
Socket AM3	140	2.7GHz	1MB	45W

FEATURES	AMD SEMPRON™ CPU (SOCKET AM3)	INTEL CELERON® D LGA775
Processor-To-System Bandwidth	System Bus: up to 6.4 GB/s Memory Controller: up to 10.6 GB/s Total: up to 17.0 GB/s	Total: up to 8.0 GB/s
3D and Multimedia Instructions	3DNow!™ Professional technology,SSE, SSE2, SSE3	SSE, SSE2, SSE3
L2 Cache	L2 cache: 1MB	Total Cache: 256KB or 512KB
L1 Cache (Instruction + Data)	128KB (64KB + 64KB)	32KB or 64KB
Process Technology	45 nanometer SOI technology	65 nanometer
Thermal Design Power	45W	65W

AMD Radeon™ Solid State Drives (SSD)

FEATURES

​OCZ Barefoot 3 Controller technology – Delivers the performance and endurance you need for an efficient computing experience

Next generation flash – The A19 NAND flash from Toshiba delivers high performance at a cost you can afford

Design – The sleek black alloy housing offers a slimmer 7mm size compatible with desktop PCs as well as ultra-thin notebooks

Acronis® True Image™ HD – Easily transfer games, programs and data from your old hard drive to your AMD Radeon™ R7 series SSD

Warranty – Experience workload endurance rated at 30GB/day of host writes for four years1

Accessories – Includes a free-of-charge 3.5” desktop adapter

SPECS

Physical	​
Usable Capacities	120GB - 480GB
NAND Components	Toshiba A19nm Multi-Level Cell (MLC)
Interface	Serial ATA (SATA) 6Gb/s (SATA III)
Controller	Indilinx Barefoot 3 M00
Form Factor	2.5 inch, 7mm height
Dimensions	99.70 x 69.75 x 7.00 mm
Weight	115g

Reliability / Compatibility	​
Data Path Protection	BCH ECC corrects up to 44 random bits/1KB
MTBF	2.3 million hours
Encryption	256-bit AES-compliant
Product Health Monitoring	Self-Monitoring, Analysis and Reporting Technology (SMART) Support
Endurance	Rated for 30GB/day of host writes for 4 years under typical client workloads
Serial ATA	Fully compliant with Serial ATA International Organization: Serial ATA Revision 3.2. Fully compliant with ATA/ ATAPI-8 Standard Native Command Queuing (NCQ)
Operating Systems	Windows, Linux, Mac OSX
Power Requirements	Standard SATA Power Connector
Targeted Applications	Client workstations and laptops

Environmental	​
Power Consumption	Idle: 0.60W Active: 3.45W
Operating Temperature	0°C - 70°C
Storage Temperature	-45°C - 85°C
Shock Resistance	1000G/0.5ms
Vibration (Operational)	2.17Grms (7-800Hz)
Vibration (Non-operational)	3.13Grms (5-800Hz)
Altitude (Operational)	-1,000ft. to 10,000ft
Altitude (Non-operational)	-1,000ft. to 40,000ft
Certifications	UL C/US, FCC, CE, C-Tick, KCC, BSMI, VCCI, WEEE

PERFORMANCE

	RADEON ™ R7 120G SSD	RADEON™ R7 240G SSD	RADEON™ R7 480G SSD
Max Capacity	120GB	240GB	480GB
Max Read2	550 MB/s	550 MB/s	550 MB/s
Max Write2	470 MB/s	530 MB/s	530 MB/s
FOB Random Read IOPS (4K QD32)3	85,000 IOPS	95,000 IOPS	100,000 IOPS
FOB Random Write IOPS (4K QD32)3	90,000 IOPS	90,000 IOPS	90,000 IOPS
Steady State Random Write IOPS (4K QD32)4	12,000 IOPS	20,000 IOPS	23,000 IOPS

                      AMD VS INTEL COMPARISSON

These are interesting times for CPU makers. Gone are the days where a few hours’ laptop battery life was considered efficient and where the only computers people had in their homes were noisy, hot desktops. Now, the pre-built desktop PC is all but a dead man walking: in 2013 the market collapsed with desktop sales falling 9.8 percent globally. In emerging markets the story was even worse: a fall of 11.3 percent as users sought smaller, cheaper, less-power hungry devices.

In 2014 there was a bit of a boost as businesses replaced PCs when support for Windows XP ended, but in 2015 shipments again fell. According to analysts, there will only be a "moderate decline" overall because more Windows tablets and hybrids - 2-in-1 laptop/tablets - were sold.

Overall, the result has been upheaval for the silicone industry’s main players. Less than a decade ago, Intel and AMD had the world at their feet. Intel’s distinctive audio logo rang out wherever laptops were sold and AMD’s future was considerably bright thanks to its 2006 acquisition of graphics powerhouse ATI. These chip giants haven't quite kept up with the times, though. The tech landscape is fast changing and Intel and AMD's apparent slowness to switch focus to mobile computing has allowed other chip manufacturers – most notably ARM but also the likes of VIA and Qualcomm – to dominate this huge new market.

Intel vs AMD: Why it matters

If you’re buying a traditional laptop or PC, AMD and Intel are your only choices for processors, but don’t make the mistake of thinking the PC’s slump in popularity means either company is sliding towards irrelevance. Both have ground to make up but in 2014 Intel’s total revenue was $55.8bn (around £36bn) and it was sitting on a cash pile of $5.67bn (around £3.7bn). Intel doesn't make all its money from PC and laptop processors, of course. It also produces graphics processors, wired and wireless network adaptors, server and workstation processors and components, plus set-top box parts. While you won't find an Intel processor in many smartphones or tablets, the firm does produce many SoCs for mobile devices.

AMD is the smaller of the two companies by some margin. For one thing, while Intel builds its own chips in over a dozen fabrication (fab) plants in the USA, Ireland, Israel and China, AMD sold off its last fab in 2009. Today, just like ARM, VIA, MediaTek and others, AMD designs its own chips but outsources the manufacturing. Producing microprocessors is formidably expensive and AMD’s revenue pales in comparison to Intel’s: merely $5.51bn (£3.5bn).

Intel vs AMD: History and breakthroughs

Both companies have a history of innovation. When Intel produced the 8080 processor in 1974, it lay the groundwork for the x86 processors which provided the foundations for desktop PCs for nearly 30 years. It’s an astute marketeer, too: its mid-2000s Centrino platform, consisting of a low-power processor, a wireless chip and a mobile chipset, took the market by storm with its reputation for desktop-class computing power and long battery life. Its shift from the x86 brand to “Pentium” (copyrighting a series of numbers proved impossible) was a similar stroke of PR genius.

The ability of Intel’s marketing department to outspend and out-think others continues. The success of Intel’s Ultrabook trademark might be perilously tied to Microsoft’s stumbling efforts with Windows 8, but the company’s understanding that consumers need short, snappy brands rather than clock frequencies and other jargon endures.

AMD’s position as underdog is a consistent one. Marketing consultant Mercury Research reported AMD hit a record 22 percent share of the market in 2006; now the company hovers around the 17 percent mark, thanks in part to its dominance of the console market: both the Xbox One and PlayStation 4 have custom 8-core AMD 'Jaguar' processors at their hearts.

Arguably, AMD’s largest recent innovation was its acquisition of Graphics Processing Unit (GPU) manufacturer ATI in 2006. The $5.6bn transaction (about £3bn) saw AMD join Intel in being able to deliver integrated graphics chips - that is, GPUs that live on the same chip as the CPU. The result is less graphical horsepower, but vastly reduced power draw and heat output. Forget fire-breathing, discrete graphics cards (last year's Radeon R9 280X drew around 250W at its peak and needed two cooling fans) – AMD understood that the future of silicone lay in reducing power consumption and size as much as in increasing computational power. These days, people don't need more power: they want better battery life from portable devices.

AMD vs Intel: Challenges

On the face of it, both AMD and Intel were well-placed to answer the needs of users as the sales of mobile devices exploded. The desktop PC market was in steady decline, laptop sales were on the rise, and the mobile phone was begging for reinvention. Intel already had an incredibly strong reputation with its laptop Centrino platform, and while AMD’s Turion competitor was a distant second, the race was on to win a market that knew mobility was the future of computing.

Intel started strongly. Remember the netbook? Before the netbook, spending less than £500 on a laptop would net you something slow and bulky with limited battery life. The first netbooks – the likes of the Asus Eee PC 701, released in the UK in 2007 – cost under £200, weighed under a kilo and, while unlikely to be seen at many LAN gaming parties, offered enough processing power to run basic work applications and – critically – applications that ran in web browsers. The processor at its heart? An ultra-low voltage version of the humble Celeron.

The netbook was a critical and commercial success, and Intel capitalised with its Atom processors. This was Intel silicone at its cheapest: bought in batches of a thousand the earliest Atom CPUs were reputed to cost manufacturers under $30, and for a few years the netbook ruled. Consumers wanted small, cheap computers and Intel, with its wealth of experience in mobile processors, was perfectly placed to answer the call.

The problem arrived in tablet form.“We don't know how to make a $500 computer that's not a piece of junk,” said Steve Jobs in 2008. “Netbooks aren’t better than anything,” he added at the 2010 launch of the first generation iPad. Apple’s chief operating officer Tim Cook agreed, describing netbooks as “not a good consumer experience”, and thus the iPad came to be.

The issue for Intel and AMD was not that they failed to anticipate consumer’s preference for mobile devices. The problem was the form factor: the iPad sold 300,000 units on the first day of its availability in 2010. In picking traditional form factor laptops and netbooks, with traditional desktop operating systems built around traditional x86 hardware, Intel and AMD had backed the wrong horse. In fact, Intel, Microsoft and HP had tried to make tablets a success years before the iPad, but the combination of Windows (an OS designed for the keyboard and mouse), short battery life and chunky, heavy hardware meant no-one wanted to use them.

The problem for Intel and AMD wasn’t that the iPad – and following tablets from the likes of Sony, Samsung and others – didn’t need processors. It was that they needed a new type. And the kingdom of the SoC (system on a chip) – in which a computer’s entire functions are embedded on a single chip – was already ruled by British processor giant ARM.

ARM’s processors are a completely different architecture than the traditional chips favoured by Intel and AMD. ARM’s Reduced Instruction Set Computing (RISC) processors are physically simpler than x86 processors, which means they cost less and draw less power. As the iPad – and the stampede of tablets which followed – took off, it seemed AMD and Intel had missed a significant boat. Fast forward to 2015 and the netbook is dead, slain by high-quality tablets that perform well, offer long battery life, and cost much less than a standard laptop.

Intel vs AMD: New form factors

Even Microsoft, long-time ally of x86 hardware, piled on the misery for Intel and AMD. Windows RT, released in late 2012, was the first version of Windows that would run on ARM-powered devices, theoretically giving Microsoft access to low-cost tablets and – potentially – freezing Intel out even more. However, the Windows RT platform flopped: in 2013 Microsoft had to take a $900 million write-down on its unsold Windows RT devices, and the company’s chief financial officer Amy Hood understated things spectacularly when she said “we know we have to do better, particularly on mobile devices.”

While we were impressed with the Surface Pro 3, it's the best of a relatively bad bunch of so-called "two-in-one" devices which supposedly offer the best of both worlds: one minute a full Windows laptop, the next a tablet. The problem is that Windows 8's touch interface wasn't that good, and few developers made apps for it. Now, Microsoft's immediate future hangs on the success of Windows 10.

Intel isn’t hanging its hopes on Microsoft, though. At CES 2015, it unveiled the Curie module, a button-sized module for wearable devices. This uses the Quark SE SoC which can be powered by a coin battery. For its relatively slow start in the world of tablet, wearable and ultra-portable computing, Intel still has plenty left in the tank.

Change focus to gaming – worth around £1.72bn to the British economy according to the Association for UK Interactive Entertainment – and there’s an entirely different story to be told. Intel does deal with graphics processing, of course, but its expertise lies in integrated graphics. Integrated graphics are ideal for small laptops: an integrated graphics processor doesn’t add much to the price of a laptop, doesn’t draw too much power and – contrary to popular opinion – does offer enough 3D processing oomph for the odd game.

For anyone looking to play the latest releases at detail settings that put the latest consoles to shame, though, discrete graphics cards have always been the answer, and it’s here that AMD has a significant edge. AMD’s current crop of graphics card run the gamut from low-profile, passively-cooled cards up to its latest R9 390X cards, which retail around £400 for the card alone. Discrete graphics aren’t the only gaming arena AMD’s strong in, either. As well as having its chips in both the Xbox One and PlayStation 4, it also supplies the GPU in Nintendo’s Wii U. It might not have much to shout about in developing platforms such as tablets or hybrids, but gamers have plenty to thank it for.

If you’re building a desktop PC, the choice between AMD and Intel is as real as ever. The choice is as complicated as ever, too: visit any well-known online retailer and you’ll be faced with a choice of over 600 CPUs. If you’re driven by budget, AMD has a strong command of the lower price-points, but if you opt for AMD it doesn’t mean you exclude yourself from high-end computing: the company’s top-end Athlon processors put up a tough challenge to Intel’s flagship Core i7 CPUs.

Intel’s is dominant, though, and across mid-range and high-end processors there’s an enormous amount of choice. For powerful, everyday computing the Core i5 continues to serve well: you can pick one up for around £150 and up. True power users – those editing video, rendering 3D animations, or those who simply want to get to the top of the SETI@home leaderboard, can opt for Intel’s Core i7 chips.